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Hoffmann + Krippner supplied exhibition models for HP at Formnext

Formnext, the world’s largest additive manufacturing event with 600+ exhibitors, offers everything there is to know about the future of manufacturing technologies.

This year, despite Corona measures, the fair was once again a great success.

At the HP 3D Printing booth, we presented 3D printed models for electronic housings, IoT sensors, e-scooter charging stations, as well as mobile and weatherproof outdoor devices according to IP protection classes.We developed and produced all applications in the multi-jet fusion (MJF) process for the industrial sector. On the basis of our exhibition models, we will show you the diverse technical possibilities of this printing process.

If you have any questions, please do not hesitate to contact Jens Arend, Jens Schnur and Andreas Bayer ( / / ).